Name: Philipp-Immanuel Dietrich
Position: Research Assistant
With this Institute since: 2014

Degrees: Dipl.-Phys.
Graduation: 2014 Diplom, Eberhard Karls Universität Tübingen
Present Research Interests: Hybrid 2D/3D Photonic Integration

Journal Articles (3)

• Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
  Optica 5, 876--883 (2018) [DOI]


• Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
  In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
  Nature Photonics, 241–247 (2018) [DOI]


• Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
  In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
  Nature Photonics 12, 241--247 (2018) [DOI]

Conference Contributions (8)

• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
  3D-Printed Optics for Wafer-Scale Probing
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI]


• Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
  Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited)


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
  Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited)


• Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
  Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
  Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited)


• Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
  Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
  20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited)


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
  Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
  Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI]


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
  Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
  SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited)

Lectures (1)

• Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
  Photonic Wirebonding - from Lab to Fab
  OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)