Publications
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Journal Articles (8)
- Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Marin-Palomo, P.; Hartmann, W.; Bao, Y.; Peng, H.; Billah, M. R.; Singer, S.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
Sci Rep 11, Article Number 16426 (2021) [DOI] - Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Dankwart, C.; Xu, Y.; Hoose, T.; Billah, M. R.; Abbasi, A.; Baets, R.; Troppenz, U.; Theurer, A.; Woerhoff, K.; Seyfried, M.; Freude, W.; Koos, C.
3D-printed optical probes for wafer-level testing of photonic integrated circuits
Opt. Express 28, 37996-38007 (2020) [DOI] - Blaicher, M.; Billah, M. R.; Kemal, J. N.; Hoose, T.; Marin-Palomo, P.; Hofmann, A.; Kutuvantavida, Y.; Kieninger, C.; Dietrich, P.-I.; Lauermann, M.; Wolf, S.; Troppenz, U.; Moehrle, M.; Merget, F.; Skacel, S.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
Light: Science & Applications 9, Article number: 71 (2020) [DOI] - Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
Optica 5, 876--883 (2018) [DOI] - Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
Nature Photonics, 241–247 (2018) [DOI] - Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
Nature Photonics 12, 241--247 (2018) [DOI] - Lindenmann, N.; Dottermusch, S.; Goedecke, M. L.; Hoose, T.; Billah, M. R.; Onanuga, T.; Hofmann, A.; Freude, W.; Koos, C.
Connecting Silicon Photonic Circuits to Multi-Core Fibers by Photonic Wire Bonding
J. Lightwave Technol. 33, 755 - 760 (2015) [DOI] more, (invited) - Li, J.; Billah, M. R.; Schindler, P. C.; Lauermann, M.; Schuele, S.; Hengsbach, S.; Hollenbach, U.; Mohr, J.; Koos, C.; Freude, W.; Leuthold, J.
Four-in-one interferometer for coherent and self-coherent detection
Opt. Express 21, 13293--13304 (2013) [DOI]
Conference Contributions (24)
- Xu, Y.; Blaicher, M.; Marin-Palomo, P.; Hartmann, W.; Billah, M. R.; Troppenz, U.; Mohrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Conference on Optical Fiber Communication (OFC 2020), San Diego, CA, USA, 08.03.2020 – 12.03.2020 , paper M4H.6. (2020) [DOI] - Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Optical Fiber Communication Conference (OFC'20), San Diego (CA), USA, March 08–12 , paper M4H.6 (2020) more - Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
3D-Printed Optics for Wafer-Scale Probing
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI] - Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited) - Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited) - Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited) - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI] - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited) - Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline) - Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline) - Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI] - Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 , paper 7483033 (2016) [DOI] (invited) - Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI] - Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more - Koos, C.; Freude, W.; Leuthold, J.; Kohl, M.; Dalton, L. R.; Bogaerts, W.; Lauermann, M.; Wolf, S.; Weimann, C.; Melikyan, A.; Lindenmann, N.; Billah, M. R.; Muehlbrandt, S.; Koeber, S.; Palmer, R.; Koehnle, K.; Alloatti, L.; Elder, D. L.; Giesecke, A. L.; Wahlbrink, T.
Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform
28th Annual Conf. of the IEEE Photonics Society (IPC'15), Reston (VA), USA, Oct. 4–8 , paper MF2.1 (2015) [DOI] (invited) - Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI] - Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI] - Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , paper 897008 (2014) [DOI] (invited) - Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited) - Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 , paper 7483033 (2013) [DOI] (invited) - Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)
Lectures (9)
- Koos, C.; Kippenberg, T. J.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J. C.; Witzens, J.; Fang, D.; Drayss, D.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Fuellner, C.; Billah, M. R.; Blaicher, M.; Xu, Y.; Lauermann, M.; Skacel, S.; Lihachev, G.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Mueller, J.
Terahertz Analogue-to-Digital Conversion Using Soliton Frequency Combs and Massively Parallel Spectrally Sliced Detection (TeraSlice)
International Workshop on Mobile THz Systems (IWMTS), online event, Duisburg, Germany, July 5 – 7 (2021) (invited) - Koos, C.; Randel, S.; Freude, W.; Yokoyama, S.; Dalton, L. R.; Zwickel, H.; Kieninger, C.; Wolf, S.; Kutuvantavida, Y.; Lauermann, M.; Miura, H.; Qiu, F.; Elder, D. L.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Trappen, M.; Hoose, T.
Hybrid Photonic Integration and 3D Nano-Printing: Combining Silicon Photonics with Organic Materials
IEEE CPMT Symposium Japan (ICSJ 2019); Kyoto, Japan, November 18-20 (2019) (invited) - Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
Photonic Wirebonding - from Lab to Fab
OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited) - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding
634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) - Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
3D Printing for Advanced Photonic Integration
634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited) - Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited) - Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited) - Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany (2014) - Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
Photonic wire bonding as an enabling technology for multi-chip photonic system
OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)
Workshops (1)
- Koos, C.; Kippenberg, T. J.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J. C.; Witzens, J.; Fang, D.; Drayss, D.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Fuellner, C.; Billah, M. R.; Blaicher, M.; Xu, Y.; Lauermann, M.; Skacel, S.; Lihachev, G.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Mueller, J.
Terahertz Analogue-to-Digital Conversion Using Soliton Frequency Combs and Massively Parallel Spectrally Sliced Detection (TeraSlice)
(2021)