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Lectures (61)

  • Koos, C.
    Enabling Technologies for Hyperscale Networks
    BCICTS2020IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology SymposiumA Virtual EventNovember 16 -19, 2020 (2020) (invited)

  • Freude, W.
    Wireless THz communications
    Jaypee Institute of Information Technology, JIIT Noida, India, December 11 (2018) (invited)

  • Koos, C.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Enabling Technologies for Hyperscale Networks
    Workshop “Keysight in Network Data Center – European Seminar”; Keysight Technologies GmbH, Boeblingen, Germany, October 23 (2018) (invited)

  • Zwickel, H.; Kutuvantavida, Y.; Kieninger, C.; Freude, W.; Randel, S.; Koos, C.
    Silicon-organic hybrid integration – efficient devices for high-speed communications
    Huawei Workshop on Novel Photonics Technologies, Rome, Italy, September 21 (2018) (invited)

  • Koos, C.
    Photonic Wirebonding and 3D Nanoprinting for Optical Packaging and Assembly
    TechWatch at the China International Optoelectronic Exposition (CIOE 2018), organized by the European Photonics Industry Consortium (EPIC), September 5 (2018) (invited)

  • Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
    Photonic Wirebonding - from Lab to Fab
    OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)

  • Koos, C.
    Silicon Photonics, Hybrid Integration, and Frequency Combs - Technologies for Terabit Communications and Ultra-Fast Signal Processing
    Annual meeting of the Helmholtz Programme "Matter and Technologies", Helmholtz Zentrum Berlin, June 12 – 14 (2018) (invited)

  • Koos, C.
    Photonic Wirebonding and 3D Nanoprinting in Optical Packaging – from Research to Manufacturing
    Workshop ‘Photonic Packaging and Sub-Micron Assembly’; Fraunhofer Institute for Reliability and Microintegration (IZM); June 12 – 13 (2018) (invited)

  • Koos, C.
    Photonic Wirebonding and 3D Nanoprinting in Optical Packaging – from Research to Manufacturing
    EPIC Meeting “Automation Tools for Packaging and Testing”; organized by the European Photonic Industry Consortium (EPIC), Physik Instrumente (PI); Karlsruhe, Germany, May 22 – 23 (2018) (invited)

  • Koos, C.
    Optical Frequency Combs - Tools for High-Speed Communications and Advanced Distance Metrology
    Workshop ‘Progress in Nonlinear Photonics: Waveguides and Resonators’, Bath, UK, March 28 - 29 (2018) (invited)

  • Koos, C.
    Photonic Wire Bonding and Hybrid Photonic Integration: Technologies for Optical Communications and Beyond
    Finisar Corporation, Sunnyvale, CA, USA, February 2 (2018) (invited)

  • Koos, C.
    3D Nano-Printing for Advanced Photonic Integration and Assembly
    Seminar “Photonic Integrated Circuits (PIC)”, organized by Bayern Photonics e.V., Nurnberg, November 14 (2017) (invited)

  • Koos, C.
    3D Nano-Printing and Hybrid Photonic Integration - Technologies for Optical Metrology and Communications
    Optics Colloquium, Universität Freiburg, Institut für Mikrosystemtechnik (IMTEK), November 8 (2017) (invited)

  • Koos, C.
    Integrierte Photonik - optische Schaltkreise in zwei und drei Dimensionen
    Seminar talk at the Corporate Research Department of Schott AG, Mainz, Germany, April 7 (2017) (invited)

  • Koos, C.
    Optische Terabit-Kommunikation:Schnelle und effiziente Datenübertragung mit Licht
    erc = science² | Europäische Spitzenforschung am KIT, Karlsruhe Institute of Technology (KIT), March 16 (2017) (invited)

  • Freude, W.
    Optical modulators, network monitors, and high-speed wireless links: Towards OpEx and CapEx saving networks
    3rd Green Photonics Symposium at Technion (Russell Berrie Nanotechnology Institute), March 29- 30 , Haifa, Israel (2016) (invited)

  • Freude, W.; Koos, C.
    Silicon-organic hybrid (SOH) integration and multi-chip systems: Extending the capabilities of the silicon photonic platform
    Workshop "Silicon & Diamond Photonics", PhotonicNet GmbH, Haus der Kulturen, March 8- 9 , Braunschweig, Germany (2016) more (invited)

  • Koos, C.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications
    18th International Workshop on Physics of Semiconductor Devices (IPWSD-2015), Bangalore, India, December 7-10 (2015) (invited)

  • Koos, C.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications
    Seminar of the Institute of Semiconductor Science, Universität Stuttgart, November 2 (2015) (invited)

  • Koos, C.
    Silicon Photonics and Hybrid Integration: Technology and Applications
    Seminar Talk at corporate research department of BASF SE, Ludwigshafen, Germany, July 14 (2015) (invited)

  • Koos, C.
    Terabit Communications Using Optical Frequency Combs
    The 3rd International Workshop on Ultrafast Laser Optoelectronics (ULO 2015), July 9 (2015) (invited)

  • Koos, C.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications
    Light Conference: International Conference on Micro/Nano Optical Engineering (ICOME2015), July 7-8, Changchun, China (2015) (invited)

  • Koos, C.
    Photonic wire bonding, multi-chip integration, and wafer-level micro-optics enabled by 3D laser lithography
    Sino-German Workshop on Photonic Manufacturing, Manipulation and Measurement (PMMM2015), July 2-7, Changchun, China (2015) (invited)

  • Freude, W.
    Wissen schaffen – Anspruch und Wirklichkeit
    Vortrag im Rahmen der 'Kamingespräche' auf Einladung des Young Investigator Network (YIN) am Karlsruher Institut für Technologie (KIT), Heinrich-Hertz-Haus, Karlsruhe, April 24 (2015) (invited)

  • Koos, C.
    Integrated Photonics and Terabit Communications
    4th Europhotonics Spring School, April 13-16 (2015) (invited)

  • Koos, C.
    Silicon Photonics and Integrated Optics: Technologies and Applications
    442. Carl-Zeiss-Optikkolloquium, Carl Zeiss AG, Jena, Germany, April 7 (2015) (invited)

  • Koos, C.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications
    Infinera Corporation, Sunnyvale, CA, USA, Feb. 10 (2015) (invited)

  • Koos, C.
    Integrated Photonics and Advanced Communications
    Colloquium of the Department of Physics, Karlsruhe Institute of Technology, Germany, Dec. 4 (2014) (invited)

  • Koos, C.
    Silicon Photonics and Hybrid Photonic Integration
    Seminar talk, Osram AG, Regensburg, Germany, Nov. 6 (2014) (invited)

  • Koos, C.
    Silicon photonics, hybrid integration and photonic multi-chip systems: Enabling technologies for terabit communications
    International Seminar on Photonics, Optics, and its Applications (ISPhOA 2014), Denpasaar, Bail, Indonesia, October 14 - 15 (2014) (invited)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
    Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)

  • Koos, C.
    Electro-Optic Devices on the Silicon-Organic Hybrid (SOH) Platform
    8th Joint Symposium on Opto- & Micro-electronic Devices and Circuits (SODC ’14), Frankfurt (Oder), Germany, Sep. 8-11 (2014) (invited)

  • Koos, C.
    Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
    Seminar talk, Oclaro Inc., Caswell, UK, August 14 (2014) (invited)

  • Koos, C.; Freude, W.; Kippenberg, T. J.; Pfeifle, J.; Weimann, C.; Lauermann, M.; Brasch, V.; Herr, T.
    Terabit Communications Using Optical Frequency Combs
    SIAM Conference on Nonlinear Waves and Coherent Structures, Churchill College, University of Cambridge, UK, August 11-14 (2014) (invited)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
    EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)

  • Koos, C.
    Silicon photonics and photonic wire bonding - technologies for terabit/s optical interconnects
    Research Seminar, Carl Zeiss Semiconductor Manufacturing Technology (SMT) AG; 6. December (2013) (invited)

  • Koos, C.
    Nanophotonik, Terabits und Teratronik: Energieeffiziente Hochgeschwindigkeits-Kommunikation mit Licht
    Uni-für-Einsteiger-Tag, Karlsruhe Institute of Technology (KIT), 20.November (2013)

  • Koos, C.
    Hybrid photonic integration: an enabling technology for terabit/s communications and teratronics
    4th Karlsruhe Days of Optics & Photonics, Karlsruhe Institute of Technology (KIT), 6. November (2013)

  • Koos, C.
    Silicon-organic hybrid integration, photonic wire bonding, and frequency combs: Technologies for Tbit/s interconnects
    Seminar of the Institute of Nanotechnology (INT), Karlsruhe Institute of Technology (KIT), 30. October (2013) (invited)

  • Koeber, S.; Mappes, T.; Koos, C.
    Label-free sensing with lasing microgoblets
    Roche-Helmholtz Research Day, Penzberg, Germany, Nov. 28 (2012)

  • Koos, C.
    Silicon-organic hybrid integration, photonic wire bonding, and frequency combs: Technologies for Tbit/s interconnects
    Colloquium of the Inter-University Research School on Communication Technologies, Basic Research and Applications (COBRA), Eindhoven Unversity, The Netherlands, Oct. 12 (2012) (invited)

  • Koos, C.
    Silicon Nanophotonics and Photonic Wire Bonding: Technologies for Terabit/s Interconnects
    Seminar talk at the University of Posts and Telecommunications, Nanjing, China, Sept. 28 (2012) (invited)

  • Koos, C.
    Silicon photonics and hybrid integration: Technologies for multi-Tbit/s interconnects
    Technologies for multi-Tbit/s interconnects’; seminar talk, Universität Duisburg-Essen, December (2011) (invited)

  • Koos, C.
    Das Internet und das Klima: Energieeffizienz in der Informationstechnik
    Rotary Club Karlsruhe-Albtal, November (2011) (invited)

  • Koos, C.
    Optical Interconnects
    Forum Photonics BW, Nanoscribe GmbH, Karlsruhe, Germany, November 11 (2011) (invited)

  • Koos, C.
    Silicon photonics and hybrid integration: Technologies for multi-Tbit/s interconnects
    Elektrotechnisches Kolloquium, Universität Ulm, June (2011) (invited)

  • Koos, C.
    Nanophotonic integration: Silicon and beyond
    Seminar of the Institute for Data Processing and Electronics (IPE), Karlsruhe Institute of Technology, Germany, May 24 (2011) (invited)

  • Koos, C.
    Nanophotonic integration: Silicon and beyond
    Physikalisches Kolloquium, Technische Universität Kaiserslautern, May (2011) (invited)

  • Koos, C.
    Silicon nanophotonics and silicon-organic hybrid (SOH) integration
    Seminar of the Leibniz Institute IHP - Innovations for High-Performance Microelectronics, Frankfurt (Oder), Germany, February (2011) (invited)

  • Koos, C.
    Opportunities in Silicon Integrated Optics
    7th International ICST Conference on Broadband Communications, Networks, and Systems (BROADNETS 2010)Workshop on Next-Generation Optical Access Networks (NGOA), Athens, Greece, October (2010) (invited)

  • Koos, C.
    Silicon Nanophotonics and Silicon-Organic Hybrid (SOH) Integration
    Seminar of the Fraunhofer Institute for Applied Solid State Physics (IAF), Freiburg, Germany, July (2010)

  • Koos, C.
    Das Internet und das Klima: Energieeffizienz in der Informationstechnik
    Ceremonial lecture at the graduation ceremony of the Department of Electrical Engineering and Information Technology, Karlsruhe Institute of Technology, Germany, July (2010)

  • Koos, C.
    Silicon Nanophotonics: An Emerging Toolbox for Optical Communications
    Seminar of the Institute for Applied Physics, Karlsruhe Institute of Technology, Germany, June (2010) (invited)

  • Koos, C.
    Silicon Nanophotonics and Silicon-Organic Hybrid Integration (SOH)
    Fachbereich "Mikrosystemtechnik und Nanotechnologie" der VDE-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, Karlsruhe, Germany, June (2010) (invited)

  • Koos, C.
    Silicon Nanophotonics: Device Principles and Applications
    Seminar of the Research Training Group 'Analysis, Simulation and Design of Nanotechnological Processes', Karlsruhe Institute of Technology, Germany, June (2010) (invited)

  • Freude, W.
    Optically powered fibre networks
    Winter College on Optics and Energy, The Abdus Salam International Centre for Theoretical Physics (ICTP), Trieste, Italy, February (2010) (invited)

  • Koos, C.; Vorreau, P.; Vallaitis, T.; Dumon, P.; Bogaerts, W.; Esembeson, B.; Biaggio, I.; Michinobu, T.; Diederich, F.; Freude, W.; Leuthold, J.
    Beyond Silicon Photonics: Silicon-Organic Hybrid (SOH) Integration
    Tyndall National Institute, Cork, Ireland, November (2009) (invited)

  • Koos, C.; Vallaitis, T.; Dumon, P.; Bogaerts, W.; Baets, R.; Freude, W.; Leuthold, J.
    Silicon Nanophotonics: An Emerging Toolbox for Optical Communications
    Eurofos Summer School, Athens Information Technology, Athens, Greece, June/July (2009) (invited)

  • Freude, W.; Koos, C.; Brosi, J.-M.; Vorreau, P.; Dumon, P.; Baets, R.; Esembeson, B.; Biaggio, I.; Michinobu, T.; Diederich, F.; Leuthold, J.
    Silicon-organic hybrid photonics
    Seminar Photonics RoadMap for SMEs (FP7 Project PhotonicRoadSME), Oulu, Finland, May (2009) more (invited)

  • Koos, C.
    Silizium-Nanophotonik: Neue Bauelemente für die Kommunikationstechnik
    Kolloquium der Fakultät für Elektrotechnik und Informationstechnik, Universität Karlsruhe (TH), Germany, Sept. (2008) (invited)

  • Brosi, J.-M.; Koos, C.; Andreani, L. C.; Waldow, M.; Leuthold, J.; Freude, W.
    High-speed low-voltage electro-optic modulator with a polymer-infiltrated silicon photonic crystal waveguide
    Workshop der ITG Fachgruppe 5.3.1 Modellierung photonischer Komponenten und Systeme, Universität Kiel, 12.–13.06.2008 (2008)

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