Publications

Books (1)

• Leuthold, J.; Lindenmann, N.
  Photonic Networks
  In: Waser, R. (Ed): Nanoelectronics and Information Technology: Advanced Electronic Materials and Novel Devices, Wiley-VCH, ISBN 978-3-527-40927-3, pp. 795-814, (2012) more

Journal Articles (5)

• Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
  Optica 5, 876--883 (2018) [DOI]


• Lindenmann, N.; Dottermusch, S.; Goedecke, M. L.; Hoose, T.; Billah, M. R.; Onanuga, T.; Hofmann, A.; Freude, W.; Koos, C.
  Connecting Silicon Photonic Circuits to Multi-Core Fibers by Photonic Wire Bonding
  J. Lightwave Technol. 33, 755 - 760 (2015) [DOI] more, (invited)


• Lindenmann, N.; Balthasar, G.; Hillerkuss, D.; Schmogrow, R.; Jordan, M.; Leuthold, J.; Freude, W.; Koos, C.
  Photonic wire bonding: a novel concept for chip-scale interconnects
  Opt. Express 20, 17667--17677 (2012) [DOI]


• Hillerkuss, D.; Schmogrow, R.; Meyer, M.; Wolf, S.; Jordan, M.; Kleinow, P.; Lindenmann, N.; Schindler, P. C.; Melikyan, A.; Yang, X.; Ben-Ezra, S.; Nebendahl, B.; Dreschmann, M.; Meyer, J.; Parmigiani, F.; Petropoulos, P.; Resan, B.; Oehler, A.; Weingarten, K.; Altenhain, L.; Ellermeyer, T.; Moller, M.; Hubner, M.; Becker, J.; Koos, C.; Freude, W.; Leuthold, J.
  Single-Laser 32.5 Tbit/s Nyquist WDM Transmission
  J. Opt. Commun. Netw. 4, 715--723 (2012) [DOI]


• Melikyan, A.; Lindenmann, N.; Walheim, S.; Leufke, P. M.; Ulrich, S.; Ye, J.; Vincze, P.; Hahn, H.; Schimmel, T.; Koos, C.; Freude, W.; Leuthold, J.
  Surface plasmon polariton absorption modulator
  Opt. Express 19, 8855--8869 (2011) [DOI]

Conference Contributions (24)

• Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
  Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
  Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 , paper 7483033 (2016) [DOI] (invited)


• Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
  Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]


• Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
  Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more


• Koos, C.; Freude, W.; Leuthold, J.; Kohl, M.; Dalton, L. R.; Bogaerts, W.; Lauermann, M.; Wolf, S.; Weimann, C.; Melikyan, A.; Lindenmann, N.; Billah, M. R.; Muehlbrandt, S.; Koeber, S.; Palmer, R.; Koehnle, K.; Alloatti, L.; Elder, D. L.; Giesecke, A. L.; Wahlbrink, T.
  Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Extending the capabilities of the silicon photonic platform
  28th Annual Conf. of the IEEE Photonics Society (IPC'15), Reston (VA), USA, Oct. 4–8 , paper MF2.1 (2015) [DOI] (invited)


• Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
  Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
  Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]


• Melikyan, A.; Alloatti, L.; Muslija, A.; Hillerkuss, D.; Schindler, P. C.; Li, J.; Palmer, R.; Korn, D.; Lindenmann, N.; Muehlbrandt, S.; Walheim, S.; Vincze, P.; Leufke, P. M.; Ulrich, S.; Ye, J.; Thourhout, D. V.; Chen, B.; Dinu, R.; Sommer, M.; Hahn, H.; Schimmel, T.; Koos, C.; Kohl, M.; Freude, W.; Leuthold, J.
  High-speed Plasmonic Modulators
  Integrated Photonics Research, Silicon and Nanophotonics (IPR'14), San Diego, California United States, July 13-17 , paper IT2A.6 Optical Society of America (OSA) (2014) [DOI] (invited)


• Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
  Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
  Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]


• Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
  Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
  SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , paper 897008 (2014) [DOI] (invited)


• Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
  Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
  Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited)


• Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
  Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
  International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 , paper 7483033 (2013) [DOI] (invited)


• Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
  Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
  Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.
  Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography
  15th International Conference on Transparent Optical Networks (ICTON), 2013, June 23-27 , paper We.C2.4, Cartagena, Spain, June (2013) [DOI] (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Balthasar, G.; Hoffmann, J.; Hoose, T.; Hubner, P.; Hillerkuss, D.; Schmogrow, R.
  Photonic wire bonding: connecting nanophotonic circuits across chip boundaries
  Proc. SPIE, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI, 86130W; San Francisco (CA), USA; Feb. 2-7 8613, Paper 8613-31 (2013) [DOI] (invited)


• Hillerkuss, D.; Schmogrow, R.; Meyer, M.; Wolf, S.; Jordan, M.; Kleinow, P.; Lindenmann, N.; Schindler, P. C.; Melikyan, A.; Dreschmann, M.; Meyer, J.; Becker, J.; Koos, C.; Freude, W.; Leuthold, J.
  Single-laser 32.5 Tbit/s Nyquist-WDM
  International Conference on Photonics in Switching (PS'12), Ajaccio (Corsica), France, 11-14 September , paper 381468 (2012) more (invited)


• Lindenmann, N.; Balthasar, G.; Leuthold, J.; Freude, W.; Koos, C.
  Broadband low-loss interconnects enabled by photonic wire bonding
  Optical Interconnects Conference (OI'12), Santa Fe, New Mexico, USA, May 20-23 , 125-126, Paper WC1 IEEE, May (2012) [DOI] (invited)


• Freude, W.; Alloatti, L.; Melikyan, A.; Palmer, R.; Korn, D.; Lindenmann, N.; Vallaitis, T.; Hillerkuss, D.; Li, J.; Barklund, A.; Dinu, R.; Wieland, J.; Fournier, M.; Fedeli, J.-M.; Walheim, S.; Leufke, P. M.; Ulrich, S.; Ye, J.; Vincze, P.; Hahn, H.; Yu, H.; Bogaerts, W.; Dumon, P.; Baets, R.; Breiten, B.; Diederich, F.; Beels, M. T.; Biaggio, I.; Schimmel, T.; Koos, C.; Leuthold, J.
  Nonlinear Optics on the Silicon Platform
  Optical Fiber Communication Conference (OFC'12), Los Angeles (CA), USA, March 06-10 , OTh3H.6 Optical Society of America (2012) [DOI] (invited)


• Lindenmann, N.; Balthasar, G.; Jordan, M.; Hillerkuss, D.; Schmogrow, R.; Freude, W.; Leuthold, J.; Koos, C.
  Low-Loss Photonic Wire Bond Interconnects Enabling 5 TBit/s Data Transmission
  Optical Fiber Communication Conference (OFC'12), Los Angeles (CA), USA, 2012, March 06-10 , paper OW4I.4 Optical Society of America (OSA) (2012) [DOI]


• Schindler, P. C.; Fischer, H.; Haisch, H.; Lindenmann, N.; Alloatti, L.; Palmer, R.; Korn, D.; Hillerkuss, D.; Schmogrow, R.; Gerster, A.; Freude, W.; Leuthold, J.; Koos, C.
  Optical Technologies for Off-Chip and On-Chip Interconnects
  DesignCon 2012, Santa Clara (CA), USA, CA 1/31/2012, January/February , paper TP5 (2012) more


• Lindenmann, N.; Balthasar, G.; Palmer, R.; Schuele, S.; Leuthold, J.; Freude, W.; Koos, C.
  Photonic wire bonding for single-mode chip-to-chip interconnects
  8th IEEE International Conference on Group IV Photonics (GFP'11) , paper FD2, London, UK, Sept (2011) [DOI]


• Leuthold, J.; Freude, W.; Koos, C.; Melikyan, A.; Lindenmann, N.
  A surface plasmon polariton absorption modulator
  13th International Conference on Transparent Optical Networks (ICTON'11) , paper Mo.B2.2, Stockholm, Sweden, June (2011) [DOI]


• Lindenmann, N.; Kaiser, I.; Balthasar, G.; Bonk, R.; Hillerkuss, D.; Freude, W.; Leuthold, J.; Koos, C.
  Photonic Waveguide Bonds - A Novel Concept for Chip-to-Chip Interconnects
  Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011 , paper PDPC1 Optical Society of America (2011) [DOI]


• Melikyan, A.; Vallaitis, T.; Lindenmann, N.; Schimmel, T.; Freude, W.; Leuthold, J.
  A Surface Plasmon Polariton Absorption Modulator
  Conference on Lasers and Electro-Optics (CLEO/IQEC'10), San Jose (CA), May 16–21 , paper JThE77 Optical Society of America (2010) [DOI]


• Vallaitis, T.; Hillerkuss, D.; Li, J.; Bonk, R.; Lindenmann, N.; Dumon, P.; Baets, R.; Scimeca, M. L.; Biaggio, I.; Diederich, F.; Koos, C.; Freude, W.; Leuthold, J.
  All-optical wavelength conversion using cross-phase modulation at 42.7 Gbit/s in silicon-organic hybrid (SOH) waveguides
  International Conference on Photonics in Switching (PS'09), Pisa, Italy, September 15–19 , paper PDP3 (2009) [DOI] (postdeadline)


• Lindenmann, N.; Vallaitis, T.; Bonk, R.; Koos, C.; Freude, W.; Leuthold, J.
  Amplitude and phase dynamics in silicon compatible waveguides with highest Kerr-nonlinearities
  AMOP Spring Meeting, Deutsche Physikalische Gesellschaft, DPG Quantum Optics and Photonics Section, Hamburg, March , paper Q 57.4 (2009)

Lectures (10)

• Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
  3D Printing for Advanced Photonic Integration
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited)


• Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
  Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
  Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
  EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)


• Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
  115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany (2014)


• Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
  Photonic wire bonding as an enabling technology for multi-chip photonic system
  OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)


• Nesic, A.; Alloatti, L.; Pfeifle, J.; Lindenmann, N.; Leuthold, J.; Freude, W.; Koos, C.
  Highly Efficient Silicon-Organic Hybrid (SOH) Phase Shifters for Reconfigurable Ultra-Fast Signal Processing
  International Nano-Optoelectronics Workshop iNOW-2013, August 19-30 , Cargèse, France (2013)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Pfeifle, J.; Lindenmann, N.; Koeber, S.; Hillerkuss, D.; Schmogrow, R.
  Silicon photonics, hybrid integration and photonic wire bonding – enablers for energy-efficient terabit/s interconnects
  13th FIBER OPTICS EXPO Technical Conference, Tokyo, Japan, April 10-12 (2013) (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Palmer, R.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Pfeifle, J.; Schindler, P. C.; Hillerkuss, D.; Schmogrow, R.
  Silicon-Organic Hybrid Integration and Photonic Wire Bonding: Technologies for Terabit/s Interconnects
  Joint Symposium on Opto- and Microelectronic Dvices and Circuits (SODC2012), Hangzhou, China, Sept. 24-27 (2012) (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Alloatti, L.; Korn, D.; Lindenmann, N.; Palmer, R.; Pfeifle, J.; Hillerkuss, D.; Schmogrow, R.
  Silicon Nanophotonics and Photonic Wire Bonding: Technologies for Terabit/s Interconnects
  6th ITG Workshop on Photonic Integration, Laser Optics Berlin, March 20 (2012) (invited)

Workshops (1)

• Lindenmann, N.; Balthasar, G.; Hoose, T.; Hoffmann, J.; Hubner, P.; Freude, W.; Leuthold, J.; Koos, C.
  Photonic Wire Bonds for Broadband Low-Loss Chip-to Chip Interconnects
  Sechster Workshop Optische Technologien: Optische Information Tagungsband , 147-158, Hannoversches Zentrum für Optische Technologien, November (2012)