Publications

Journal Articles (7)

• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Dankwart, C.; Xu, Y.; Hoose, T.; Billah, M. R.; Abbasi, A.; Baets, R.; Troppenz, U.; Theurer, A.; Woerhoff, K.; Seyfried, M.; Freude, W.; Koos, C.
  3D-printed optical probes for wafer-level testing of photonic integrated circuits
  Opt. Express 28, 37996-38007 (2020) [DOI]


• Blaicher, M.; Billah, M. R.; Kemal, J. N.; Hoose, T.; Marin-Palomo, P.; Hofmann, A.; Kutuvantavida, Y.; Kieninger, C.; Dietrich, P.-I.; Lauermann, M.; Wolf, S.; Troppenz, U.; Moehrle, M.; Merget, F.; Skacel, S.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
  Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
  Light: Science & Applications 9, Article number: 71 (2020) [DOI]


• Nesic, A.; Blaicher, M.; Hoose, T.; Hofmann, A.; Lauermann, M.; Kutuvantavida, Y.; Nollenburg, M.; Randel, S.; Freude, W.; Koos, C.
  Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses
  Opt. Express 27, 17402-17425 (2019) [DOI]


• Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
  Optica 5, 876--883 (2018) [DOI]


• Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
  In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
  Nature Photonics, 241–247 (2018) [DOI]


• Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
  In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
  Nature Photonics 12, 241--247 (2018) [DOI]


• Lindenmann, N.; Dottermusch, S.; Goedecke, M. L.; Hoose, T.; Billah, M. R.; Onanuga, T.; Hofmann, A.; Freude, W.; Koos, C.
  Connecting Silicon Photonic Circuits to Multi-Core Fibers by Photonic Wire Bonding
  J. Lightwave Technol. 33, 755 - 760 (2015) [DOI] more, (invited)

Conference Contributions (23)

• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
  3D-Printed Optics for Wafer-Scale Probing
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI]


• Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
  Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited)


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
  Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited)


• Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
  Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
  Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited)


• Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
  Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
  20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited)


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
  Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
  Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI]


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
  Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
  SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited)


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
  Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
  IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited)


• Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
  43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline)


• Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
  8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
  Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)


• Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
  Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
  Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]


• Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
  Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
  Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 , paper 7483033 (2016) [DOI] (invited)


• Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
  Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]


• Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
  Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more


• Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
  Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
  Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]


• Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
  Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
  Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]


• Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
  Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
  SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , paper 897008 (2014) [DOI] (invited)


• Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
  Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
  Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited)


• Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
  Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
  International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 , paper 7483033 (2013) [DOI] (invited)


• Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
  Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
  Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.
  Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography
  15th International Conference on Transparent Optical Networks (ICTON), 2013, June 23-27 , paper We.C2.4, Cartagena, Spain, June (2013) [DOI] (invited)


• Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Balthasar, G.; Hoffmann, J.; Hoose, T.; Hubner, P.; Hillerkuss, D.; Schmogrow, R.
  Photonic wire bonding: connecting nanophotonic circuits across chip boundaries
  Proc. SPIE, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI, 86130W; San Francisco (CA), USA; Feb. 2-7 8613, Paper 8613-31 (2013) [DOI] (invited)

Lectures (10)

• Koos, C.; Randel, S.; Freude, W.; Yokoyama, S.; Dalton, L. R.; Zwickel, H.; Kieninger, C.; Wolf, S.; Kutuvantavida, Y.; Lauermann, M.; Miura, H.; Qiu, F.; Elder, D. L.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Trappen, M.; Hoose, T.
  Hybrid Photonic Integration and 3D Nano-Printing: Combining Silicon Photonics with Organic Materials
  IEEE CPMT Symposium Japan (ICSJ 2019); Kyoto, Japan, November 18-20 (2019) (invited)


• Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
  Photonic Wirebonding - from Lab to Fab
  OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017)


• Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
  3D Printing for Advanced Photonic Integration
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited)


• Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
  Hybrid 2D/3D photonic integration for non-planar circuit topologies
  42nd European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22 (2016)


• Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
  Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
  Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)


• Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
  EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)


• Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
  Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
  115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany (2014)


• Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
  Photonic wire bonding as an enabling technology for multi-chip photonic system
  OPTO SPIE Photonics West (OPTO-SPIE'14) , San Francisco (CA), USA, Feb. 1-6 (2014)

Workshops (1)

• Lindenmann, N.; Balthasar, G.; Hoose, T.; Hoffmann, J.; Hubner, P.; Freude, W.; Leuthold, J.; Koos, C.
  Photonic Wire Bonds for Broadband Low-Loss Chip-to Chip Interconnects
  Sechster Workshop Optische Technologien: Optische Information Tagungsband , 147-158, Hannoversches Zentrum für Optische Technologien, November (2012)