Publications
List publications according to yearAll | 2023 | 2022 | 2021 | 2020 | 2019 | 2018 | 2017 | 2016 | 2015 | List publications according to typeAll | Journal Articles | Conference Contributions | Lectures | Workshops |
Journal Articles (20)
- Xu, Y.; Maier, P.; Trappen, M.; Dietrich, P.-I.; Blaicher, M.; Jutas, R.; Weber, A.; Kind, T.; Dankwart, C.; Stephan, J.; Steffan, A.; Abbasi, A.; Morrissey, P.; Gradkowski, K.; Kelly, B.; O'Brien, P.; Freude, W.; Koos, C.
3D-printed facet-attached microlenses for advanced photonic system assembly
Light: Advanced Manufacturing 4, Nr. 3 (2023) [DOI] - Nesic, A.; Blaicher, M.; Marin-Palomo, P.; Fuellner, C.; Randel, S.; Freude, W.; Koos, C.
Ultra-broadband polarisation beam splitters and rotators based on 3D-printed waveguides
Light: Advanced Manufacturing 4, Nr. 22 (2023) [DOI], (published) - Maier, P.; Chen, Y.; Xu, Y.; Bao, Y.; Blaicher, M.; Geskus, D.; Dekker, R.; Liu, J.; Dietrich, P.-I.; Peng, H.; Randel, S.; Freude, W.; Kippenberg, T. J.; Koos, C.
Sub-kHz-linewidth external-cavity laser (ECL) with Si3N4 resonator used as a tunable pump for a Kerr frequency comb
Journal of Lightwave Technology, Vol. 41 Nr. 11, 3479-3490 (2023) [DOI] - Maier, P.; Xu, Y.; Trappen, M.; Lauermann, M.; Henniger-Ludwig, A.; Kapim, H.; Kind, T.; Dietrich, P.-I.; Weber, A.; Blaicher, M.; Wurster, C.; Randel, S.; Freude, W.; Koos, C.
3D-printed facet-attached optical elements for connecting VCSEL and photodiodes to fiber arrays and multi-core fibers
Opt. Express 30, 46602-46625 (2022) [DOI] - Nesic, A.; Blaicher, M.; Orlandini, E.; Olariu, T.; Paszkiewicz, M.; Negredo, F.; Kraft, P.; Sukhova, M.; Hofmann, A.; Dorfler, W.; Rockstuhl, C.; Freude, W.; Koos, C.
Transformation-optics modeling of 3D-printed freeform waveguides
Opt. Express 30, 38856-38879 (2022) [DOI] - Xu, Y.; Kuzmin, A.; Knehr, E.; Blaicher, M.; Ilin, K.; Dietrich, P.-I.; Freude, W.; Siegel, M.; Koos, C.
Superconducting nanowire single-photon detector with 3D-printed free-form microlenses
Opt. Expr. 29, 27708-27731 (2021) [DOI] - Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Marin-Palomo, P.; Hartmann, W.; Bao, Y.; Peng, H.; Billah, M. R.; Singer, S.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
Sci Rep 11, Article Number 16426 (2021) [DOI] - Anagnos, T.; Trappen, M.; Tiong, B. C. K.; Feger, T.; Yerolatsitis, S.; Harris, R. J.; Lozi, J.; Jovanovic, N.; Birks, T. A.; Vievard, S.; Guyon, O.; Gris-Sanchez, I.; Leon-Saval, S. G.; Norris, B.; Haffert, S. Y.; Hottinger, P.; Blaicher, M.; Xu, Y.; Betters, C. H.; Koos, C.; Coutts, D. W.; Schwab, C.; Quirrenbach, A.
3D-M3: high-spatial-resolution spectroscopy with extreme AO and 3D-printed micro-lenslets
Applied Optics 60, D108-D121 (2021) [DOI] - Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Dankwart, C.; Xu, Y.; Hoose, T.; Billah, M. R.; Abbasi, A.; Baets, R.; Troppenz, U.; Theurer, A.; Woerhoff, K.; Seyfried, M.; Freude, W.; Koos, C.
3D-printed optical probes for wafer-level testing of photonic integrated circuits
Opt. Express 28, 37996-38007 (2020) [DOI] - Blaicher, M.; Billah, M. R.; Kemal, J. N.; Hoose, T.; Marin-Palomo, P.; Hofmann, A.; Kutuvantavida, Y.; Kieninger, C.; Dietrich, P.-I.; Lauermann, M.; Wolf, S.; Troppenz, U.; Moehrle, M.; Merget, F.; Skacel, S.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
Light: Science & Applications 9, Article number: 71 (2020) [DOI] - Dietrich, P.-I.; Goering, G.; Trappen, M.; Blaicher, M.; Freude, W.; Schimmel, T.; Hoelscher, H.; Koos, C.
3D-Printed Scanning-Probe Microscopes with Integrated Optical Actuation and Read-Out
Small 16, Article number: 1904695 (2019) [DOI] - Harter, T.; Ummethala, S.; Blaicher, M.; Muehlbrandt, S.; Wolf, S.; Weber, M.; Adib, M. M. H.; Kemal, J. N.; Merboldt, M.; Boes, F.; Nellen, S.; Tessmann, A.; Walther, M.; Globisch, B.; Zwick, T.; Freude, W.; Randel, S.; Koos, C.
Wireless THz link with optoelectronic transmitter and receiver
Optica 6, 1063--1070 (2019) [DOI] - Nesic, A.; Blaicher, M.; Hoose, T.; Hofmann, A.; Lauermann, M.; Kutuvantavida, Y.; Nollenburg, M.; Randel, S.; Freude, W.; Koos, C.
Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses
Opt. Express 27, 17402-17425 (2019) [DOI] - Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
Optica 5, 876--883 (2018) [DOI] - Kieninger, C.; Kutuvantavida, Y.; Elder, D. L.; Wolf, S.; Zwickel, H.; Blaicher, M.; Kemal, J. N.; Lauermann, M.; Randel, S.; Freude, W.; Dalton, L. R.; Koos, C.
Ultra-high electro-optic activity demonstrated in a silicon-organic hybrid modulator
Optica 5, 739--748 (2018) [DOI] - Negredo, F.; Blaicher, M.; Nesic, A.; Kraft, P.; Ott, J.; Dorfler, W.; Koos, C.; Rockstuhl, C.
Fast and reliable method to estimate losses of single-mode waveguides with an arbitrary 2D trajectory
Journal of the OSA A 35, 1063--1073 (2018) [DOI] - Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
Nature Photonics, 241–247 (2018) [DOI] - Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
Nature Photonics 12, 241--247 (2018) [DOI] - Dietrich, P.-I.; Harris, R. J.; Blaicher, M.; Corrigan, M. K.; Morris, T. M.; Freude, W.; Quirrenbach, A.; Koos, C.
Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems
Opt. Express 25, 18288--18295 (2017) [DOI] - Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
Tailored probes for atomic force microscopy fabricated by two-photon polymerization
Applied Physics Letters 109, 063101 (2016) [DOI]
Conference Contributions (23)
- Maier, P.; Xu, Y.; Blaicher, M.; Geskus, D.; Dekker, R.; Liu, J.; Dietrich, P.-I.; Peng, H.; Randel, S.; Freude, W.; Kippenberg, T. J.; Koos, C.
InP/Si3N4 Hybrid External-Cavity Laser With sub-kHz Linewidth Acting as a Pump Source for Kerr Frequency Combs
European Conference on Optical Communication (ECOC 2022), Basel, Switzerland, Sept. 18-22 , paper We2E.4 (2022) more - Maier, P.; Xu, Y.; Lauermann, M.; Henniger-Ludwig, A.; Kapim, H.; Trappen, M.; Kind, T.; Weber, A.; Blaicher, M.; Dietrich, P.-I.; Wurster, C.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly
Optical Fiber Communications Conference and Exhibition (OFC'22); San Diego, CA, USA, March 06–10 , paper W2A.1 (2022) [DOI] more - Trappen, M.; Dietrich, P.-I.; Burger, P.; Blaicher, M.; Goering, G.; Schimmel, T.; Freude, W.; Hoelscher, H.; Koos, C.
AFM engine with optical actuation and readout printed on the facet of a multi-core fiber
2020 Conference on Lasers and Electro-Optics (CLEO), San Jose (CA), USA, May 10-15 , paper SM2N.7 (2020) more - Xu, Y.; Blaicher, M.; Marin-Palomo, P.; Hartmann, W.; Billah, M. R.; Troppenz, U.; Mohrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Conference on Optical Fiber Communication (OFC 2020), San Diego, CA, USA, 08.03.2020 – 12.03.2020 , paper M4H.6. (2020) [DOI] - Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Optical Fiber Communication Conference (OFC'20), San Diego (CA), USA, March 08–12 , paper M4H.6 (2020) more - Su, Y.; Trappen, M.; Blaicher, M.; Koos, C.; Nahm, W.
A 3D resolution and aberration test target for confocal laser endomicroscopy
SPIE BiOS 2020, San Francisco (CA), USA, Feb. 01-03 , volume 11229 (2020) [DOI] - Freude, W.; Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Wolf, S.; Weber, M.; Boes, F.; Massler, H.; Tessmann, A.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Globisch, B.; Walther, M.; Zwick, T.; Randel, S.; Koos, C.
Wireless Terahertz Communications
Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), pp. 1-1 , paper 8873098 (2019) [DOI] - Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
3D-Printed Optics for Wafer-Scale Probing
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI] - Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited) - Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited) - Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited) - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more - Kohler, D.; Wondimu, S. F.; Hahn, L.; Allegro, I.; Blaicher, M.; Freude, W.; Koos, C.
Lasing in Si3N4-Organic Hybrid (SiNOH) Spiral Resonators
Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper SM4I.6 (2018) [DOI] more - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI] - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited) - Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited) - Harter, T.; Adib, M. M. H.; Wolf, S.; Muehlbrandt, S.; Weber, M.; Blaicher, M.; Boes, F.; Massler, H.; Tessmann, A.; Nellen, S.; Goebel, T.; Giesekus, J.; Walther, M.; Zwick, T.; Freude, W.; Randel, S.; Koos, C.
Wireless Multi-Subcarrier THz Communications Using Mixing in a Photoconductor for Coherent Reception
IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper MA4.2 (2017) [DOI] - Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline) - Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline) - Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI] - Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI] - Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more
Lectures (7)
- Koos, C.; Kippenberg, T. J.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J. C.; Witzens, J.; Fang, D.; Drayss, D.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Fuellner, C.; Billah, M. R.; Blaicher, M.; Xu, Y.; Lauermann, M.; Skacel, S.; Lihachev, G.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Mueller, J.
Terahertz Analogue-to-Digital Conversion Using Soliton Frequency Combs and Massively Parallel Spectrally Sliced Detection (TeraSlice)
International Workshop on Mobile THz Systems (IWMTS), online event, Duisburg, Germany, July 5 – 7 (2021) (invited) - Koos, C.; Randel, S.; Freude, W.; Yokoyama, S.; Dalton, L. R.; Zwickel, H.; Kieninger, C.; Wolf, S.; Kutuvantavida, Y.; Lauermann, M.; Miura, H.; Qiu, F.; Elder, D. L.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Trappen, M.; Hoose, T.
Hybrid Photonic Integration and 3D Nano-Printing: Combining Silicon Photonics with Organic Materials
IEEE CPMT Symposium Japan (ICSJ 2019); Kyoto, Japan, November 18-20 (2019) (invited) - Freude, W.; Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Wolf, S.; Weber, M.; Boes, F.; Massler, H.; Tessmann, A.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Goebel, T.; Walther, M.; Zwick, T.; Randel, S.; Koos, C.
Terahertz communications meets photonics
14th Intern. Conf. on Fiber Optics & Photonics (Photonics'18), Indian Institute of Technology Delhi (IIT Delhi), Delhi, India, December 12–15 (2018) (invited) - Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Koehnle, K.; Adib, M. M. H.; Weber, M.; Wolf, S.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Tessmann, A.; Walther, M.; Zwick, T.; Randel, S.; Freude, W.; Koos, C.
Wireless terahertz communications using optoelectronic techniques
40th Progress In Electromagnetics Research Symposium (PIERS 2018), Toyama, Japan, 01.08.2018 – 04.08.2018 (2018) - Freude, W.; Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Wolf, S.; Weber, M.; Boes, F.; Massler, H.; Tessmann, A.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Goebel, T.; Walther, M.; Zwick, T.; Randel, S.; Koos, C.
Wireless THz communications using optoelectronic techniques
Light: Science & Applications, Light Conference (Light Conference'18), Changchun, China, July 16-18 (2018) (invited) - Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
Multi-Chip Integration by Photonic Wire Bonding
634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) - Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
Hybrid 2D/3D photonic integration for non-planar circuit topologies
42nd European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22 (2016)
Workshops (1)
- Koos, C.; Kippenberg, T. J.; Randel, S.; Freude, W.; Zwick, T.; Scheytt, J. C.; Witzens, J.; Fang, D.; Drayss, D.; Harter, T.; Ummethala, S.; Kieninger, C.; Zwickel, H.; Marin-Palomo, P.; Fuellner, C.; Billah, M. R.; Blaicher, M.; Xu, Y.; Lauermann, M.; Skacel, S.; Lihachev, G.; Schaefer, J.; Gudyriev, S.; Zazzi, A.; Mueller, J.
Terahertz Analogue-to-Digital Conversion Using Soliton Frequency Combs and Massively Parallel Spectrally Sliced Detection (TeraSlice)
(2021)