Publications of type Inproceedings

Conference Contributions (12)

• Maier, P.; Xu, Y.; Blaicher, M.; Geskus, D.; Dekker, R.; Liu, J.; Dietrich, P.-I.; Peng, H.; Randel, S.; Freude, W.; Kippenberg, T. J.; Koos, C.
  InP/Si3N4 Hybrid External-Cavity Laser With sub-kHz Linewidth Acting as a Pump Source for Kerr Frequency Combs
  European Conference on Optical Communication (ECOC 2022), Basel, Switzerland, Sept. 18-22 , paper We2E.4 (2022) more


• Singer, S.; Xu, Y.; Skacel, S.; Zwickel, H.; Maier, P.; Dietrich, P.-I.; Kaschel, M.; Menzel, C.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Facet-Attached Optical Elements for Beam Shaping in Solid-State Phased Arrays
  Conference on Lasers and Electro-Optics 2022 (CLEO 2022), San José, U.S.A., May 15-20 , Paper SM4P.5 (2022) [DOI]


• Maier, P.; Bremauer, C.; Bao, Y.; Xu, Y.; Ganin, D.; Randel, S.; Freude, W.; Koos, C.
  Swept-Source Optical Coherence Tomography (SS-OCT) Using a Hybrid Silicon Photonic External-Cavity Laser (ECL)
  Conference on Lasers and Electro-Optics (CLEO'22), San Jose, CA, USA, May 15-19 , paper AM5I.4 (2022) more


• Maier, P.; Xu, Y.; Lauermann, M.; Henniger-Ludwig, A.; Kapim, H.; Trappen, M.; Kind, T.; Weber, A.; Blaicher, M.; Dietrich, P.-I.; Wurster, C.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly
  Optical Fiber Communications Conference and Exhibition (OFC'22); San Diego, CA, USA, March 06–10 , paper W2A.1 (2022) [DOI] more


• Harris, R. J.; Pike, F.; Trappen, M.; Haffert, S. Y.; Xu, Y.; Benoit, A.; Ross, C.; MacLachlan, D.; Barboza, S.; Maier, P.
  Multi-core fibre-fed integral field spectrograph (MCIFU) IV: the fiber link
  R. Geyl & R. Navarro (Eds.), Advances in Optical and Mechanical Technologies for Telescopes and Instrumentation IV : Dec. 14-22, online, USA Eds.: Ramón Navarro, Roland Geyl, 80, SPIE , Volume 11451, 1145124 (2020) [DOI]


• Xu, Y.; Blaicher, M.; Marin-Palomo, P.; Hartmann, W.; Billah, M. R.; Troppenz, U.; Mohrle, M.; Randel, S.; Freude, W.; Koos, C.
  InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
  Conference on Optical Fiber Communication (OFC 2020), San Diego, CA, USA, 08.03.2020 – 12.03.2020 , paper M4H.6. (2020) [DOI]


• Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
  Optical Fiber Communication Conference (OFC'20), San Diego (CA), USA, March 08–12 , paper M4H.6 (2020) more


• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
  3D-Printed Optics for Wafer-Scale Probing
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI]


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
  Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited)


• Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
  Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
  20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited)


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
  Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
  SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited)


• Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
  43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline)