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Halbleiterbauelemente SS2018

Die Ergebnisse der schriftlichen Prüfung sind im Schaukasten/am Schwarzen Brett des Instituts bekannt gegeben!

Die Klausureinsicht "Halbleiterbauelemente"

 

Wann:    Donnerstag, 08.11.2018

  • 09:30 – 11:30
    Wo:
    NTI, Geb. 30.10, Besprechungsraum 3.32

  • 13:00 – 15:00
    Wo:
    NTI, Geb. 30.10, Seminarraum 3.42

 

Institute of Photonics and Quantum Electronics
Logo IPQ

Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeIgk8∂ipq kit edu

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Join Us

We are currently looking for ambitious postdocs and PhD candidates with strong theoretical and/or experimental background to join our recently acquired projects such as the ERC Grant TeraSHAPE!

Open positions

Welcome to the Institute of Photonics and Quantum Electronics (IPQ)

 

News

Nature Photonics
Nature Photonics: Silicon integration of terahertz systems

October, 2018: Scientists of IPQ and IMT have demonstrated ultra-fast silicon-plasmonic devices for generation and detection of terahertz signals. The devices can be integrated on the silicon photonic platform, bringing together photonics, electronics and terahertz technologies on a common substrate. The concept offers promising perspectives for a wide variety of applications, including high-speed communications, life sciences and industrial metrology. The publication appeared in the October issue of Nature Photonics.

Media response: Nature Photonics
Original publication:  Nature Photonics

 
Mit einem hochfrequenten Abtast-Oszilloskop lassen sich sogenannte Augendiagramme generieren, mit deren Hilfe die Signalqualität der Datenübertragung beurteilt wird.
Ultra-high electro-optic activity demonstrated in a silicon-organic hybrid modulator

June 2018: Scientists of IPQ, IMT and University of Washington have demonstrated the highest in-device electro-optic (EO) activity in a high-speed EO modulator so far. This was achieved by using the organic EO material JRD1, which is the result of theory-guided optimization of its molecular design. In the so-called silicon-organic hybrid integration concept, this material was combined with standard silicon-photonic waveguides, forming hybrid modulators. The devices operate very efficiently, enabling high-quality optical data transmission at 40 Gbit/s with ultra-low drive voltages as low as 140 mVpp. Thus, based on these devices, highly energy-efficient communication networks could be realized in the near future and the devices could be of prime importance for low-power information processing in tomorrow’s data centers.

Original publication: Optica

KIT Press release: German

 
Preisträger Innovationspreis
IPQ/IMT team receives Second Prize at the competition for the Berthold-Leibinger Innovation Prize

July 2018: The IPQ/IMT project team "DELPHI - 3D Laser Lithography for Photonic Integration" will receive the Second Prize of the renowned Berthold-Leibinger Innovation Prize. The DELPHI project group, headed by Christian Koos, was dedicated to industrial adoption of femtosecond laser lithography as a tool for 3D additive nanofabrication in integrated photonics and has led to foundation of the start-up company Vanguard Photonics GmbH. The project builds upon multi-photon lithography for fabrication of single-mode photonic waveguides and free-form micro-optical elements for efficient coupling of optical microchips. The award ceremony will take place on September 21, 2018 in Ditzingen, Germany.

Learn more
 
Optica Cover Bild
Optica: Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

July 2018: The additive 3D nanostructure group of IPQ and IMT has demonstrated efficient coupling of III-V light sources to silicon photonic circuits using photonic wire bonding (PWB). The technique exploits direct-write two-photon lithography for in situ fabrication of three-dimensional freeform waveguides between optical chips. The work showed that the PWBs can have insertion losses as low as 0.4 dB and introduce no detrimental effect on the linewidth or the threshold of the DFB lasers. Combined with previously demonstrated chip-to-chip and fiber-to-chip connections, we expect photonic wire bonding to evolve into a universal integration platform for hybrid photonic multi-chip assemblies.

The published work is made as the cover of Optica Vol. 5, Issue 7, 2018.

Original publication: Optica

KIT Newsletter: German

 
3D Nanodruck
Nature Photonics: In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration

March 2018: Scientists of IPQ and IMT have demonstrated microscopic beam-shaping elements that can be directly printed to the facets of optical chips or fibers by means of multi-photon lithography. The beam shaping elements comprise free-form lenses and mirrors as well as more complex multi-lens systems such as beam expanders. Facet-attached optical elements can dramatically relax alignment tolerances of optical coupling interfaces, thus paving the way to automated assembly of photonic multi-chip systems with unprecedented performance and versatility.

KIT Press release: German

Original publication: Nature Photonics

 
Video for Gips Schüle Research Award Ceremony 2017