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Institute of Photonics and Quantum Electronics
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76131 Karlsruhe
Germany

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Dipl.-Phys. Philipp-Immanuel Dietrich

Room: Bldg. 307 Room 337 (IMT) / Bldg. 30.10 Room 2.23/1 (IPQ)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41935 (IPQ)
philipp-immanuel dietrichBdc7∂kit edu




Publications of 2017


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Journal Articles (2)

  • Zakhurdaeva, A.; Dietrich, P.-I.; Hoelscher, H.; Koos, C.; Korvink, J.; Sharma, S.
    Custom-Designed Glassy Carbon Tips for Atomic Force Microscopy
    Micromachines 8 (2017) [DOI]

  • Dietrich, P.-I.; Harris, R. J.; Blaicher, M.; Corrigan, M. K.; Morris, T. M.; Freude, W.; Quirrenbach, A.; Koos, C.
    Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems
    Opt. Express 25, 18288--18295 (2017) [DOI]


Conference Contributions (6)

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
    Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
    IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited)

  • Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
    Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
    43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline)

  • Koos, C.; Freude, W.; Guber, A. E.; Schimmel, T.; Lauermann, M.; Schneider, S.; Weimann, C.; Muehlbrandt, S.; Harter, T.; Wondimu, S. F.; Wienhold, T.; von der Ecken, S.; Dietrich, P.-I.; Goering, G.
    Photonic Integration for Metrology and Sensing
    OSA Integrated Photonics Research, Silicon, and Nano- Photonics (IPR), New Orleans, Louisiana, USA, 24 - 27 July , paper ITh1A.1. (2017) [DOI] (invited)

  • Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
    8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
    Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding
    634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 , best poster prize (2017)

  • Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
    3D Printing for Advanced Photonic Integration
    634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited)

Curriculum Vitae - Philipp Dietrich

Name: Philipp-Immanuel Dietrich
Position: Research Assistant
With this Institute since: 2014

Degrees: Dipl.-Phys.
Graduation: 2014 Diplom, Eberhard Karls Universität Tübingen
Present Research Interests: Hybrid 2D/3D Photonic Integration