Home | Legals | Data Protection | Sitemap | KIT
Institute of Photonics and Quantum Electronics
Logo IPQ

Building 30.10
Engesserstr. 5
76131 Karlsruhe

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeEdu2∂ipq kit edu

Directions to KIT


Dipl.-Phys. Philipp-Immanuel Dietrich

Room: Bldg. 307 Room 337 (IMT) / Bldg. 30.10 Room 2.23/1 (IPQ)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41935 (IPQ)
philipp-immanuel dietrichAzi8∂kit edu

Publications of 2016

List publications according to year

All | 2019 | 2018 | 2017 | 2016 | 2015

List publications according to type

All | Journal Articles | Conference Contributions | Lectures

Journal Articles (2)

  • Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
    Tailored probes for atomic force microscopy fabricated by two-photon polymerization
    Applied Physics Letters 109, 063101 (2016) [DOI]

  • Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Freude, W.; Koos, C.
    Optical coherence tomography system mass-producible on a silicon photonic chip
    Opt. Express 24, 1573-1586 (2016) [DOI]

Conference Contributions (4)

  • Freude, W.; Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Koos, C.
    Silicon photonic integrated circuit for optical coherence tomography
    18th Intern. Conf. on Transparent Optical Networks (ICTON'16), Trento, Italy, July 10-14 , paper Tu.C5.1 (2016) [DOI] (invited)

  • Freude, W.; Schneider, S.; Weimann, C.; Hoeller, F.; Lauermann, M.; Dietrich, P.-I.; Koos, C.
    Integrated optics for optical coherence tomography and surface topography characterization
    Light: Science & Applications, Light Conference (Light Conference'16, Speakers), Changchun, China, July 4-8 (2016) (invited)

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

Curriculum Vitae - Philipp Dietrich

Name: Philipp-Immanuel Dietrich
Position: Research Assistant
With this Institute since: 2014

Degrees: Dipl.-Phys.
Graduation: 2014 Diplom, Eberhard Karls Universität Tübingen
Present Research Interests: Hybrid 2D/3D Photonic Integration