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Institute of Photonics and Quantum Electronics
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Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeGpr8∂ipq kit edu

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Dipl.-Phys. Philipp-Immanuel Dietrich

Room: Bldg. 307 Room 337 (IMT) / Bldg. 30.10 Room 2.23/1 (IPQ)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41935 (IPQ)
philipp-immanuel dietrichAlz1∂kit edu




Publications


List publications according to year

All | 2018 | 2017 | 2016 | 2015

List publications according to type

All | Journal Articles | Conference Contributions

Journal Articles (5)

  • Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
    In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
    Nature Photonics 12, 241--247 (2018) [DOI]

  • Zakhurdaeva, A.; Dietrich, P.-I.; Hoelscher, H.; Koos, C.; Korvink, J.; Sharma, S.
    Custom-Designed Glassy Carbon Tips for Atomic Force Microscopy
    Micromachines 8 (2017) [DOI]

  • Dietrich, P.-I.; Harris, R. J.; Blaicher, M.; Corrigan, M. K.; Morris, T. M.; Freude, W.; Quirrenbach, A.; Koos, C.
    Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems
    Opt. Express 25, 18288--18295 (2017) [DOI]

  • Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
    Tailored probes for atomic force microscopy fabricated by two-photon polymerization
    Applied Physics Letters 109, 063101 (2016) [DOI]

  • Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Freude, W.; Koos, C.
    Optical coherence tomography system mass-producible on a silicon photonic chip
    Opt. Express 24, 1573-1586 (2016) [DOI]


Conference Contributions (17)

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
    Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
    44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 (2018) (invited)

  • Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
    Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
    Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 (2018) (invited)

  • Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
    Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
    20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) (invited)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
    3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
    Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI]

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
    Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
    SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited)

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
    Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
    IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited)

  • Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
    Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
    43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline)

  • Koos, C.; Freude, W.; Guber, A. E.; Schimmel, T.; Lauermann, M.; Schneider, S.; Weimann, C.; Muehlbrandt, S.; Harter, T.; Wondimu, S. F.; Wienhold, T.; von der Ecken, S.; Dietrich, P.-I.; Goering, G.
    Photonic Integration for Metrology and Sensing
    OSA Integrated Photonics Research, Silicon, and Nano- Photonics (IPR), New Orleans, Louisiana, USA, 24 - 27 July , paper ITh1A.1. (2017) [DOI] (invited)

  • Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
    8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
    Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding
    634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 , best poster prize (2017)

  • Freude, W.; Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Koos, C.
    Silicon photonic integrated circuit for optical coherence tomography
    18th Intern. Conf. on Transparent Optical Networks (ICTON'16), Trento, Italy, July 10-14 , paper Tu.C5.1 (2016) [DOI] (invited)

  • Freude, W.; Schneider, S.; Weimann, C.; Hoeller, F.; Lauermann, M.; Dietrich, P.-I.; Koos, C.
    Integrated optics for optical coherence tomography and surface topography characterization
    Light: Science & Applications, Light Conference (Light Conference'16, Speakers), Changchun, China, July 4-8 (2016) (invited)

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

  • Hofmann, A.; Kroeger, M.; Ungerer, M.; Wondimu, S. F.; Dietrich, P.-I.; Wienhold, T.; Lauermann, M.; Kohler, D.; Koos, C.; Bretthauer, G.
    Dosierplattform zur Deposition von optisch aktiven Medien für Anwendungen in der Photonik
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106627 (2015) more

  • Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
    Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more

  • Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
    Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
    Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]

Curriculum Vitae - Philipp Dietrich

Name: Philipp-Immanuel Dietrich
Position: Research Assistant
With this Institute since: 2014

Degrees: Dipl.-Phys.
Graduation: 2014 Diplom, Eberhard Karls Universität Tübingen
Present Research Interests: Hybrid 2D/3D Photonic Integration