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Institute of Photonics and Quantum Electronics
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Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeNky7∂ipq kit edu

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Matthias Blaicher

M.Sc. Matthias Blaicher

Room: IPQ: Buildg. 30.10 Room 2.22 (Campus South) / IMT: Bldg. 307 Room 337 (Campus Nord)
Phone: +49 721 608-41934 (IPQ)/ -26824 (IMT)
matthias blaicherArb2∂kit edu




Publications


List publications according to year

All | 2018 | 2017 | 2016 | 2015

List publications according to type

All | Journal Articles | Conference Contributions

Journal Articles (4)

  • Negredo, F.; Blaicher, M.; Nesic, A.; Kraft, P.; Ott, J.; Dorfler, W.; Koos, C.; Rockstuhl, C.
    Fast and reliable method to estimate losses of single-mode waveguides with an arbitrary 2D trajectory
    J. Opt. Soc. Am. A 35, 1063--1073 (2018) [DOI]

  • Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
    In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
    Nature Photonics 12, 241--247 (2018) [DOI]

  • Dietrich, P.-I.; Harris, R. J.; Blaicher, M.; Corrigan, M. K.; Morris, T. M.; Freude, W.; Quirrenbach, A.; Koos, C.
    Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems
    Opt. Express 25, 18288--18295 (2017) [DOI]

  • Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
    Tailored probes for atomic force microscopy fabricated by two-photon polymerization
    Applied Physics Letters 109, 063101 (2016) [DOI]


Conference Contributions (16)

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
    Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
    44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 (2018) (invited)

  • Harter, T.; Ummethala, S.; Muehlbrandt, S.; Blaicher, M.; Koehnle, K.; Adib, M.; Weber, M.; Wolf, S.; Kutuvantavida, Y.; Kemal, J. N.; Nellen, S.; Hahn, L.; Tessmann, A.; Walther, M.; Zwick, T.; Randel, S.; Freude, W.; Koos, C.
    Wireless terahertz communications using optoelectronic techniques
    Progress in Electromagnetics Research Symposium 2018 (PIERS 2018), Toyama, Japan, August 1-4 (2018) (invited)

  • Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
    Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
    Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 (2018) (invited)

  • Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
    Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
    20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) (invited)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
    3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
    Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI]

  • Kohler, D.; Wondimu, S. F.; Hahn, L.; Allegro, I.; Blaicher, M.; Freude, W.; Koos, C.
    Lasing in Si3N4-Organic Hybrid (SiNOH) Spiral Resonators
    Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper SM4I.6 (2018) [DOI]

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
    Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
    SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited)

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
    Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
    IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited)

  • Harter, T.; Adib, M.; Wolf, S.; Muehlbrandt, S.; Weber, M.; Blaicher, M.; Boes, F.; Massler, H.; Tessmann, A.; Nellen, S.; Goebel, T.; Giesekus, J.; Walther, M.; Zwick, T.; Freude, W.; Randel, S.; Koos, C.
    Wireless Multi-Subcarrier THz Communications Using Mixing in a Photoconductor for Coherent Reception
    IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper MA4.2 (2017) [DOI]

  • Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
    Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
    43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline)

  • Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
    8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
    Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding
    634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 , best poster prize (2017)

  • Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
    Hybrid 2D/3D photonic integration for non-planar circuit topologies
    42th European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22 (2016) more

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

  • Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
    Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more

Curriculum Vitae - Matthias Blaicher

Name: Matthias Blaicher
Position: Research Assistant
With this Institute since: 2014

Degrees: M. Sc. (Physics)
Graduation: 2014 Karlsruhe Institute of Technology (KIT)

Present Research Interests: Industrial Scale Hybrid 2D/3D Photonic Integration