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Institute of Photonics and Quantum Electronics
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Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeQvz9∂ipq kit edu

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M. Sc. Muhammad Rodlin Billah

Room: Building 307, Room 337, IMT (Campus North)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41934 (IPQ)
muhammad billahFhl5∂kit edu

 IPQ ( Campus South)

Building: 30.10

Room:    2.22

Phone:   +49 721 608-41934





Publications of 2018


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All | Journal Articles | Conference Contributions | Lectures

Journal Articles (2)

  • Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
    Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
    Optica 5, 876--883 (2018) [DOI]

  • Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
    In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
    Nature Photonics 12, 241--247 (2018) [DOI]


Conference Contributions (7)

  • Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
    3D-Printed Optics for Wafer-Scale Probing
    44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI]

  • Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
    Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
    44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited)

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
    Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
    44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 (2018) [DOI] (invited)

  • Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
    Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
    Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 (2018) [DOI] (invited)

  • Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
    Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
    20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
    3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
    Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI]

  • Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
    Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
    SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) more (invited)

Lectures (1)

  • Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
    Photonic Wirebonding - from Lab to Fab
    OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)

Curriculum Vitae - Muhammad Rodlin Billah

Name: Muhammad Rodlin Billah

Degrees: M. Sc.

With the Institute since: February 2013

Research Interests:

  • 3D Photonic Integration