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Institute of Photonics and Quantum Electronics
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Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeKlp7∂ipq kit edu

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M. Sc. Muhammad Rodlin Billah

Room: Building 307, Room 337, IMT (Campus North)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41934 (IPQ)
muhammad billahHoi3∂kit edu

 IPQ ( Campus South)

Building: 30.10

Room:    2.22

Phone:   +49 721 608-41934





Publications of 2016


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Conference Contributions (3)

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
    Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
    Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 (2016) [DOI] (invited)

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

Curriculum Vitae - Muhammad Rodlin Billah

Name: Muhammad Rodlin Billah

Degrees: M. Sc.

With the Institute since: February 2013

Research Interests:

  • 3D Photonic Integration