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Institute of Photonics and Quantum Electronics
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Building 30.10
Engesserstr. 5
76131 Karlsruhe

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeSmz9∂ipq kit edu

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M. Sc. Muhammad Rodlin Billah

Room: Building 307, Room 337, IMT (Campus North)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41934 (IPQ)
muhammad billahJbj6∂kit edu

 IPQ ( Campus South)

Building: 30.10

Room:    2.22

Phone:   +49 721 608-41934

Publications of 2014

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All | Journal Articles | Conference Contributions | Lectures

Conference Contributions (4)

  • Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
    115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany , talk H1 Deutsche Gesellschaft für angewandte Optik e.V. (DGaO) (2014)

  • Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
    Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
    Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]

  • Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
    Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
    SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , 897008-897008-10 (2014) [DOI] (invited)

  • Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
    Photonic wire bonding as an enabling technology for multi-chip photonic system
    OPTO SPIE Photonics West (OPTO-SPIE'14) , 8991-5, San Francisco (CA), USA, Feb. 1-6 (2014)

Lectures (2)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
    Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
    EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)

Curriculum Vitae - Muhammad Rodlin Billah

Name: Muhammad Rodlin Billah

Degrees: M. Sc.

With the Institute since: February 2013

Research Interests:

  • 3D Photonic Integration