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Institute of Photonics and Quantum Electronics
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Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeUut3∂ipq kit edu

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Billah picture

M. Sc. Muhammad Rodlin Billah

Room: Building 307, Room 337, IMT (Campus North)
Phone: +49 721 608-26840 (IMT) / +49 721 608-41934 (IPQ)
muhammad billahFin3∂kit edu

 IPQ ( Campus South)

Building: 30.10

Room:    2.22

Phone:   +49 721 608-41934





Publications of type Lecture


List publications according to year

All | 2018 | 2017 | 2016 | 2015 | 2014 | 2013

List publications according to type

All | Journal Articles | Conference Contributions | Lectures

Lectures (3)

  • Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
    Photonic Wirebonding - from Lab to Fab
    OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
    Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
    EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)

Curriculum Vitae - Muhammad Rodlin Billah

Name: Muhammad Rodlin Billah

Degrees: M. Sc.

With the Institute since: February 2013

Research Interests:

  • 3D Photonic Integration