Name: Philipp-Immanuel Dietrich
Position: Research Assistant
With this Institute since: 2014

Degrees: Dipl.-Phys.
Graduation: 2014 Diplom, Eberhard Karls Universität Tübingen
Present Research Interests: Hybrid 2D/3D Photonic Integration

Journal Articles (16)

• Xu, Y.; Maier, P.; Trappen, M.; Dietrich, P.-I.; Blaicher, M.; Jutas, R.; Weber, A.; Kind, T.; Dankwart, C.; Stephan, J.; Steffan, A.; Abbasi, A.; Morrissey, P.; Gradkowski, K.; Kelly, B.; O'Brien, P.; Freude, W.; Koos, C.
  3D-printed facet-attached microlenses for advanced photonic system assembly
  Light: Advanced Manufacturing 4, Nr. 3 (2023) [DOI]


• Maier, P.; Chen, Y.; Xu, Y.; Bao, Y.; Blaicher, M.; Geskus, D.; Dekker, R.; Liu, J.; Dietrich, P.-I.; Peng, H.; Randel, S.; Freude, W.; Kippenberg, T. J.; Koos, C.
  Sub-kHz-linewidth external-cavity laser (ECL) with Si3N4 resonator used as a tunable pump for a Kerr frequency comb
  Journal of Lightwave Technology, Vol. 41 Nr. 11, 3479-3490 (2023) [DOI]


• Maier, P.; Xu, Y.; Trappen, M.; Lauermann, M.; Henniger-Ludwig, A.; Kapim, H.; Kind, T.; Dietrich, P.-I.; Weber, A.; Blaicher, M.; Wurster, C.; Randel, S.; Freude, W.; Koos, C.
  3D-printed facet-attached optical elements for connecting VCSEL and photodiodes to fiber arrays and multi-core fibers
  Opt. Express 30, 46602-46625 (2022) [DOI]


• Singer, S.; Xu, Y.; Skacel, S. T.; Bao, Y.; Zwickel, H.; Maier, P.; Freter, L.; Dietrich, P.-I.; Kaschel, M.; Menzel, C.; Randel, S.; Freude, W.; Koos, C.
  3D-printed facet-attached optical elements for beam shaping in optical phased arrays
  Opt. Express 30, 46564-46574 (2022) [DOI]


• Xu, Y.; Kuzmin, A.; Knehr, E.; Blaicher, M.; Ilin, K.; Dietrich, P.-I.; Freude, W.; Siegel, M.; Koos, C.
  Superconducting nanowire single-photon detector with 3D-printed free-form microlenses
  Opt. Expr. 29, 27708-27731 (2021) [DOI]


• Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Marin-Palomo, P.; Hartmann, W.; Bao, Y.; Peng, H.; Billah, M. R.; Singer, S.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
  Sci Rep 11, Article Number 16426 (2021) [DOI]


• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Dankwart, C.; Xu, Y.; Hoose, T.; Billah, M. R.; Abbasi, A.; Baets, R.; Troppenz, U.; Theurer, A.; Woerhoff, K.; Seyfried, M.; Freude, W.; Koos, C.
  3D-printed optical probes for wafer-level testing of photonic integrated circuits
  Opt. Express 28, 37996-38007 (2020) [DOI]


• Blaicher, M.; Billah, M. R.; Kemal, J. N.; Hoose, T.; Marin-Palomo, P.; Hofmann, A.; Kutuvantavida, Y.; Kieninger, C.; Dietrich, P.-I.; Lauermann, M.; Wolf, S.; Troppenz, U.; Moehrle, M.; Merget, F.; Skacel, S.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
  Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
  Light: Science & Applications 9, Article number: 71 (2020) [DOI]


• Dietrich, P.-I.; Goering, G.; Trappen, M.; Blaicher, M.; Freude, W.; Schimmel, T.; Hoelscher, H.; Koos, C.
  3D-Printed Scanning-Probe Microscopes with Integrated Optical Actuation and Read-Out
  Small 16, Article number: 1904695 (2019) [DOI]


• Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Marin-Palomo, P.; Lindenmann, N.; Nesic, A.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
  Optica 5, 876--883 (2018) [DOI]


• Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
  In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
  Nature Photonics, 241–247 (2018) [DOI]


• Dietrich, P.-I.; Blaicher, M.; Reuter, I.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Troppenz, U.; Moehrle, M.; Freude, W.; Koos, C.
  In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration
  Nature Photonics 12, 241--247 (2018) [DOI]


• Zakhurdaeva, A.; Dietrich, P.-I.; Hoelscher, H.; Koos, C.; Korvink, J.; Sharma, S.
  Custom-Designed Glassy Carbon Tips for Atomic Force Microscopy
  Micromachines 8, Article number: 285 (2017) [DOI]


• Dietrich, P.-I.; Harris, R. J.; Blaicher, M.; Corrigan, M. K.; Morris, T. M.; Freude, W.; Quirrenbach, A.; Koos, C.
  Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems
  Opt. Express 25, 18288--18295 (2017) [DOI]


• Goering, G.; Dietrich, P.-I.; Blaicher, M.; Sharma, S.; Korvink, J.; Schimmel, T.; Koos, C.; Hoelscher, H.
  Tailored probes for atomic force microscopy fabricated by two-photon polymerization
  Applied Physics Letters 109, 063101 (2016) [DOI]


• Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Freude, W.; Koos, C.
  Optical coherence tomography system mass-producible on a silicon photonic chip
  Opt. Express 24, 1573-1586 (2016) [DOI]

Conference Contributions (24)

• Krimmer, J.; Stohr, S.; Dietrich, P.-I.; Schmidt, S.; Kapim, H.; Henniger-Ludwig, A.; Randel, S.
  Space-Division Multiplexing for the Fiber-Optic Networking Infrastructure of Datacenters
  Photonic Networks; 24th ITG Symposium 2023, May 09-10 , Leipzig, Germany (2023)


• Maier, P.; Xu, Y.; Blaicher, M.; Geskus, D.; Dekker, R.; Liu, J.; Dietrich, P.-I.; Peng, H.; Randel, S.; Freude, W.; Kippenberg, T. J.; Koos, C.
  InP/Si3N4 Hybrid External-Cavity Laser With sub-kHz Linewidth Acting as a Pump Source for Kerr Frequency Combs
  European Conference on Optical Communication (ECOC 2022), Basel, Switzerland, Sept. 18-22 , paper We2E.4 (2022) more


• Singer, S.; Xu, Y.; Skacel, S.; Zwickel, H.; Maier, P.; Dietrich, P.-I.; Kaschel, M.; Menzel, C.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Facet-Attached Optical Elements for Beam Shaping in Solid-State Phased Arrays
  Conference on Lasers and Electro-Optics 2022 (CLEO 2022), San José, U.S.A., May 15-20 , Paper SM4P.5 (2022) [DOI]


• Maier, P.; Xu, Y.; Lauermann, M.; Henniger-Ludwig, A.; Kapim, H.; Trappen, M.; Kind, T.; Weber, A.; Blaicher, M.; Dietrich, P.-I.; Wurster, C.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly
  Optical Fiber Communications Conference and Exhibition (OFC'22); San Diego, CA, USA, March 06–10 , paper W2A.1 (2022) [DOI] more


• Trappen, M.; Dietrich, P.-I.; Burger, P.; Blaicher, M.; Goering, G.; Schimmel, T.; Freude, W.; Hoelscher, H.; Koos, C.
  AFM engine with optical actuation and readout printed on the facet of a multi-core fiber
  2020 Conference on Lasers and Electro-Optics (CLEO), San Jose (CA), USA, May 10-15 , paper SM2N.7 (2020) more


• Xu, Y.; Maier, P.; Blaicher, M.; Dietrich, P.-I.; Billah, M. R.; Marin-Palomo, P.; Hartmann, W.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
  Optical Fiber Communication Conference (OFC'20), San Diego (CA), USA, March 08–12 , paper M4H.6 (2020) more


• Trappen, M.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Billah, M. R.; Freude, W.; Koos, C.
  3D-Printed Optics for Wafer-Scale Probing
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Tu4C.2 (2018) [DOI]


• Hoose, T.; Blaicher, M.; Kemal, J. N.; Zwickel, H.; Billah, M. R.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Randel, S.; Koos, C.
  Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper Mo4H.3 (2018) [DOI] (invited)


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Kemal, J. N.; Nesic, A.; Hofmann, A.
  Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production
  44th European Conference on Optical Communication (ECOC'18), Rome, Italy, September 23-27 , paper 8535426 (2018) [DOI] (invited)


• Koos, C.; Randel, S.; Freude, W.; Dalton, L. R.; Wolf, S.; Kieninger, C.; Kutuvantavida, Y.; Lauermann, M.; Elder, D. L.; Muehlbrandt, S.; Zwickel, H.; Melikyan, A.; Harter, T.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.
  Hybrid Photonic Integration and Plasmonic Devices: New Perspectives for High-Speed Communications and Ultra-Fast Signal Processing
  Pacific Rim Conference on Lasers and Electro-Optics (CLEO-PR 2018), Hong Kong, July 29 – August 3 , pp. 1-2 (2018) [DOI] more (invited)


• Koos, C.; Freude, W.; Randel, S.; Dietrich, P.-I.; Blaicher, M.; Xu, Y.; Billah, M. R.; Hoose, T.; Trappen, M.; Hofmann, A.
  Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics
  20th International Conference on Transparent Optical Networks (ICTON'18), Bucharest, Romania, July 1 – 5 , paper Mo.D5.5 (2018) [DOI] (invited)


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
  Conf. on Lasers and Electro-Optics (CLEO'18), San Jose (CA), USA, May 13–18 , paper STh1A.1 (2018) [DOI] more


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Randel, S.; Freude, W.; Koos, C.
  3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
  Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2018) , paper STh1A.1 (2018) [DOI]


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Hoose, T.; Xu, Y.; Hofmann, A.
  Photonic Wirebonding and 3D Nanoprinting in Optical Packaging: From Research to Manufacturing
  SPIE Photonics Europe 2018 Strasbourg, April 23 – 26 , paper 10686-7 (2018) (invited)


• Koos, C.; Freude, W.; Randel, S.; Billah, M. R.; Blaicher, M.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Hofmann, A.
  Hybrid Photonic Multi-chip Integration Enabled by 3D Nano-printing
  IEEE Photonics Conference (IPC2017), Orlando, Florida, USA, 1-5 October , paper ThF1.4 (2017) [DOI] (invited)


• Billah, M. R.; Kemal, J. N.; Marin-Palomo, P.; Blaicher, M.; Kutuvantavida, Y.; Kieninger, C.; Zwickel, H.; Dietrich, P.-I.; Wolf, S.; Hoose, T.; Xu, Y.; Troppenz, U.; Moehrle, M.; Randel, S.; Freude, W.; Koos, C.
  Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators
  43rd European Conf. Opt. Commun. (ECOC'17), Gothenburg, Sweden, Sept. 17 –21 , paper Th.PDP.C.1 (2017) [DOI] (postdeadline)


• Koos, C.; Freude, W.; Guber, A. E.; Schimmel, T.; Lauermann, M.; Schneider, S.; Weimann, C.; Muehlbrandt, S.; Harter, T.; Wondimu, S. F.; Wienhold, T.; von der Ecken, S.; Dietrich, P.-I.; Goering, G.
  Photonic Integration for Metrology and Sensing
  OSA Integrated Photonics Research, Silicon, and Nano- Photonics (IPR), New Orleans, Louisiana, USA, 24 - 27 July , paper ITh1A.1. (2017) [DOI] (invited)


• Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
  8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
  Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)


• Freude, W.; Schneider, S.; Lauermann, M.; Dietrich, P.-I.; Weimann, C.; Koos, C.
  Silicon photonic integrated circuit for optical coherence tomography
  18th Intern. Conf. on Transparent Optical Networks (ICTON'16), Trento, Italy, July 10-14 , paper Tu.C5.1 (2016) [DOI] (invited)


• Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
  Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
  Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]


• Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
  Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]


• Hofmann, A.; Kroeger, M.; Ungerer, M.; Wondimu, S. F.; Dietrich, P.-I.; Wienhold, T.; Lauermann, M.; Kohler, D.; Koos, C.; Bretthauer, G.
  Dosierplattform zur Deposition von optisch aktiven Medien für Anwendungen in der Photonik
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106627 (2015) more


• Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
  Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
  MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more


• Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
  Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
  Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]

Lectures (5)

• Koos, C.; Randel, S.; Freude, W.; Yokoyama, S.; Dalton, L. R.; Zwickel, H.; Kieninger, C.; Wolf, S.; Kutuvantavida, Y.; Lauermann, M.; Miura, H.; Qiu, F.; Elder, D. L.; Ummethala, S.; Billah, M. R.; Blaicher, M.; Dietrich, P.-I.; Trappen, M.; Hoose, T.
  Hybrid Photonic Integration and 3D Nano-Printing: Combining Silicon Photonics with Organic Materials
  IEEE CPMT Symposium Japan (ICSJ 2019); Kyoto, Japan, November 18-20 (2019) (invited)


• Koos, C.; Dietrich, P.-I.; Billah, M. R.; Hoose, T.; Xu, Y.; Trappen, M.; Nesic, A.; Hofmann, A.
  Photonic Wirebonding - from Lab to Fab
  OptecNet Jahrestagung, Berlin, Germany, June 20 – 21 (2018) (invited)


• Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
  Multi-Chip Integration by Photonic Wire Bonding
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017)


• Koos, C.; Freude, W.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Nesic, A.; Lindenmann, N.; Hofmann, A.
  3D Printing for Advanced Photonic Integration
  634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 (2017) (invited)


• Freude, W.; Schneider, S.; Weimann, C.; Hoeller, F.; Lauermann, M.; Dietrich, P.-I.; Koos, C.
  Integrated optics for optical coherence tomography and surface topography characterization
  Light: Science & Applications, Light Conference (Light Conference'16, Speakers), Changchun, China, July 4-8 (2016) (invited)