Publications of Tobias Hoose

'Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration,';
Koos C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Huebner, P.; Billah, M.;
OSA Integrated Photonics Research, Silicon and Nanophotonics (IPR'13); Paper IM4A.3; Rio Grande, Puerto Rico, USA, July 14–17, 2013 [invited]