Home | Legals | Sitemap | KIT
Institute of Photonics and Quantum Electronics
Logo IPQ

Building 30.10
Engesserstr. 5
76131 Karlsruhe
Germany

Phone: +49 (0)721 608-42481
Fax:     +49 (0)721 608-42786
E-Mail: officeDmh8∂ipq kit edu

Directions to KIT

Tobias_Hoose

Dipl.-Phys. Tobias Hoose

Room: IPQ: Buildg. 30.10 Room 2.22 (Campus South) / IMT: Bldg. 307 Room 337 (Campus Nord)
Phone: +49 721 608-41934 (IPQ)/ -26824 (IMT)
tobias hooseGim6∂kit edu




Publications


List publications according to year

All | 2017 | 2016 | 2015 | 2014 | 2013 | 2012

List publications according to type

All | Journal Articles | Conference Contributions | Lectures | Workshops

Journal Articles (1)

  • Lindenmann, N.; Dottermusch, S.; Goedecke, M. L.; Hoose, T.; Billah, M. R.; Onanuga, T.; Hofmann, A.; Freude, W.; Koos, C.
    Connecting Silicon Photonic Circuits to Multi-Core Fibers by Photonic Wire Bonding
    J. Lightwave Technol. 33, 755 - 760 (2015) [DOI] more, (invited)


Conference Contributions (18)

  • Billah, M. R.; Blaicher, M.; Kemal, J. N.; Hoose, T.; Zwickel, H.; Dietrich, P.-I.; Troppenz, U.; Moehrle, M.; Merget, F.; Hofmann, A.; Witzens, J.; Randel, S.; Freude, W.; Koos, C.
    8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding
    Optical Fiber Communication Conference (OFC'17), Los Angeles (CA), USA, March 19–23 , paper Th5D.6. (2017) [DOI] (postdeadline)

  • Blaicher, M.; Billah, M. R.; Hoose, T.; Dietrich, P.-I.; Hofmann, A.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding
    634. WE-Heraeus-Seminar "Merging Micro- and Nano-Optics: 3D Printing for Advanced and Functional Optics", Bad Honnef, Germany, January 9-11 , best poster prize (2017)

  • Nesic, A.; Blaicher, M.; Hoose, T.; Lauermann, M.; Kutuvantavida, Y.; Freude, W.; Koos, C.
    Hybrid 2D/3D photonic integration for non-planar circuit topologies
    42th European Conf. Opt. Commun. (ECOC'16), Düsseldorf, Germany, Sept. 18–22 (2016) more

  • Dietrich, P.-I.; Reuter, I.; Blaicher, M.; Schneider, S.; Billah, M. R.; Hoose, T.; Hofmann, A.; Caer, C.; Dangel, R.; Offrein, B.; Moehrle, M.; Troppenz, U.; Zander, M.; Freude, W.; Koos, C.
    Lenses for Low-Loss Chip-to-Fiber and Fiber-to-Fiber Coupling Fabricated by 3D Direct-Write Lithography
    Conf. on Lasers and Electro-Optics (CLEO'16), San Jose (CA), USA, June 5 – 10 , paper SM1G.4. (2016) [DOI]

  • Koos, C.; Freude, W.; Leuthold, J.; Dalton, L. R.; Wolf, S.; Zwickel, H.; Hoose, T.; Billah, M. R.; Lauermann, M.; Weimann, C.; Hartmann, W.; Melikyan, A.; Lindenmann, N.; Koeber, S.; Palmer, R.; Alloatti, L.; Giesecke, A. L.; Wahlbrink, T.
    Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
    Optical Interconnects Conference (OI'16), Hyatt Regency Mission Bay Spa & Marina, San Diego, California, USA, May 9-11 (2016) [DOI] (invited)

  • Hoose, T.; Billah, M. R.; Marin-Palomo, P.; Blaicher, M.; Dietrich, P.-I.; Hofmann, A.; Troppenz, U.; Moehrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
    Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips
    Optical Fiber Communication Conference (OFC'16), Anaheim (CA), USA, March 20–24 , paper M2I.7 (2016) [DOI]

  • Mai, C.; Lischke, S.; Kroh, M.; Hoose, T.; Lindenmann, N.; Koos, C.; Mai, A.; Zimmermann, L.
    Optische Schnittstelle für photonische Wirebonds in photonischer BiCMOS-Technologie
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 (2015) more

  • Dietrich, P.-I.; Wondimu, S. F.; Wienhold, T.; Steidle, M.; Hofmann, A.; Lindenmann, N.; Billah, M. R.; Hoose, T.; Blaicher, M.; Freude, W.; Koos, C.
    Herstellung mikrooptischer Komponenten durch Zwei-Photonen-Polymerisation
    MikroSystemTechnik-Kongress 2015, Karlsruhe, Germany, Oct. 26–28 , EDAS Paper-ID 1570106799 (2015) more

  • Billah, M. R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.-I.; Wingert, T.; Goedecke, M. L.; Hofmann, A.; Troppenz, U.; Sigmund, A.; Moehrle, M.; Freude, W.; Koos, C.
    Multi-Chip Integration of Lasers and Silicon Photonics by Photonic Wire Bonding
    Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15 , paper STu2F.2. Optical Society of America (OSA) (2015) [DOI]

  • Koos, C.; Freude, W.; Palmer, R.; Lauermann, M.; Koeber, S.; Pfeifle, J.; Weimann, C.; Schindler, P. C.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Silicon Photonics, Hybrid Integration, and Frequency Combs: Technologies for Terabit/s Communications, Teratronics, and Optical Metrology
    115th Annual DGaO Conference (DGaO'14), June 10 - 14, Karlsruhe, Germany , talk H1 Deutsche Gesellschaft für angewandte Optik e.V. (DGaO) (2014)

  • Lindenmann, N.; Dottermusch, S.; Hoose, T.; Billah, M. R.; Koeber, S.; Freude, W.; Koos, C.
    Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding
    Optical Interconnects Conference (OI'14), Loews Coronado Bay, Coronado, California, USA, , 131-132 IEEE, May 4-7 (2014) [DOI]

  • Koos, C.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
    Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
    SPIE 8970 (LASE-SPIE'14), Laser 3D Manufacturing, March , 897008-897008-10 (2014) [DOI] (invited)

  • Lindenmann, N.; Hoose, T.; Steenhusen, S.; Billah, M. R.; Koeber, S.; Houbertz-Krauss, R.; Koos, C.
    Photonic wire bonding as an enabling technology for multi-chip photonic system
    OPTO SPIE Photonics West (OPTO-SPIE'14) , 8991-5, San Francisco (CA), USA, Feb. 1-6 (2014)

  • Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.; Yu, H.; Bogaerts, W.; Baets, R.; Fournier, M.; Fedeli, J.-M.; Dinu, R.; Bolten, J.; Wahlbrink, T.; Waldow, M.
    Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems
    Frontiers in Optics (FiO'13), Orlando (FL), USA, October 05–10 , paper FTu1E.3 Optical Society of America (OSA) (2013) [DOI] (invited)

  • Koos, C.; Freude, W.; Leuthold, J.; Alloatti, L.; Palmer, R.; Korn, D.; Pfeifle, J.; Schindler, P. C.; Lauermann, M.; Nesic, A.; Lindenmann, N.; Koeber, S.; Hoose, T.; Billah, M. R.
    Silicon-organic hybrid (SOH) integration, photonic wire bonding, and frequency combs: Technologies for multi-terabit/s interconnects
    International Nano-Optoelectronics Workshop iNOW-2013, Cargèse, France, August 19-30 (2013) (invited)

  • Koos, C.; Freude, W.; Leuthold, J.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.; Billah, M. R.
    Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration
    Advanced Photonics 2013: Integrated Photonics Research, Silicon and Nanophotonics (IPR'13), July 14–17 , paper IM4A.3 Optical Society of America (OSA), Rio Grande, Puerto Rico, USA (2013) [DOI] (invited)

  • Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Hoffmann, J.; Hoose, T.; Hubner, P.
    Photonic wire bonding: Nanophotonic interconnects fabricated by direct-write 3D lithography
    15th International Conference on Transparent Optical Networks (ICTON), 2013, June 23-27 , paper We.C2.4, Cartagena, Spain, June (2013) [DOI] (invited)

  • Koos, C.; Leuthold, J.; Freude, W.; Lindenmann, N.; Koeber, S.; Balthasar, G.; Hoffmann, J.; Hoose, T.; Hubner, P.; Hillerkuss, D.; Schmogrow, R.
    Photonic wire bonding: connecting nanophotonic circuits across chip boundaries
    Proc. SPIE, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI, 86130W; San Francisco (CA), USA; Feb. 2-7 8613, Paper 8613-31 (2013) [DOI] (invited)

Lectures (2)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic wire bonding: Level-1 packaging and multi-chip integration enabled by 3D laser lithography
    Workshop “Photonic Packaging”, Fraunhofer IZM, Berlin, Germany, Sept. 10 – 11 (2014) (invited)

  • Koos, C.; Freude, W.; Lindenmann, N.; Hoose, T.; Billah, M. R.
    Photonic Wire Bonding: Optical die packages and multi-chip modules enabled by 3D laser lithography
    EPIC Technology Workshop “Photonic Integrated Circuits Packaging Standardization”; organized by the European Photonic Industry Consortium (EPIC), TE Connectivity, s’Hertogenbosch, Netherlands, June 18– 19 (2014) (invited)

Workshops (1)

  • Lindenmann, N.; Balthasar, G.; Hoose, T.; Hoffmann, J.; Hubner, P.; Freude, W.; Leuthold, J.; Koos, C.
    Photonic Wire Bonds for Broadband Low-Loss Chip-to Chip Interconnects
    Sechster Workshop Optische Technologien: Optische Information Tagungsband , 147-158, Hannoversches Zentrum für Optische Technologien, November (2012)

Curriculum Vitae of Tobias Hoose

Name: Tobias Hoose

With this Institute since: 2011

Degrees: Dipl. Phys. (University of Karlsruhe)

Present Research Interests:

  • 3D Photonic Integration